Tool Loadport Purge (TLP)

Name: Tool Loadport Purge (TLP)
Brand: MFSG

FOUP SMIF Pod

Tool Loadport Purge (TLP) is designed to provide controlled N₂ or XCDA purging at semiconductor equipment load ports, helping maintain a controlled environment within the FOUP or SMIF Pod during wafer processing and material transfer. It can be integrated with existing load ports and AMHS operations to support improved contamination control and wafer protection. MFSG's TLP 1.0 is capable of reducing FOUP humidity to below 1% RH within an extremely short period of time.

Key Features

Configurable Speed Purging

Easy Setup & Maintenance

Independent Control Board

Purge activated only when a carrier is present

GUI for real time status display and tool operation

Compatible with Multiple EAP Communication Protocols

Optional Configurations：

Position check： Position sensor

Environment monitor： Temperature and humidity sensor

Flow control： Pressure gauge, Flow meter and Mass Flow Controller (MFC)

Purge Control Software

Purge Control Software provides intelligent, efficient and reliable supervisory control for purge operations. With configurable purge strategies and comprehensive status monitoring, it helps maintain clean, stable humidity conditions inside wafer carriers to protect wafer performance and quality.

Through the web-based UI, users can adjust proportional valves, control gas flow in real time, configure monitoring thresholds for temperature, humidity, flow and pressure, and manually operate solenoid valves.