CN
Front Purge System (FPS)
Designed for FOUP purging, the system provides an effective solution for reducing wafer cross-contamination and oxidation between process steps. When combined with MFSG's TLP, the FPS helps maximize process yield and cost efficiency in semiconductor fabs. It supports high-flow, rapid purging, while the air knife installed inside the EFEM helps maintain low humidity and low particle levels within the FOUP.
Prevent backflow of contaminants from Equipment Front End Module (EFEM) to carrier
Prevent AMC, Moisture and Oxygen on carrier and wafer during process & Queue time
Temperature, Humidity and Flow rate data collection and monitoring
Extend Queue time as N2/XCDA in FOUP protect & prevent wafer from deterioration while pending for the next process
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