Solution

Smarter Flow. Stronger Fab.

Powered by AI-driven dispatching, full-scope AMHS products and fab-wide delivery experience, MFSG helps semiconductor manufacturers build cleaner, faster and more scalable material flow.

Capabilities

Why Choose
Our AMHS Solution

Full Scope. Seamless Flow.

Unify Transport, Storage, Purge, Control and Monitoring Software into one AMHS solution, helping your fab simplify coordination and keep materials moving smoothly.

Smart Dispatch. Fast Response.

Improve task assignment, routing and fleet coordination with AI-driven dispatching, reducing congestion and improving equipment utilization at scale.

Clean Handling. Operational Stability.

Protect high-value carriers through clean, controlled movement, storage and buffering, supporting stable production across critical fab areas.

Proven Delivery. Reliable Scale.

Turn complex AMHS plans into reliable fab-wide implementation, from simulation and integration to lifecycle service.

Flexible Design. Future Ready.

Configure systems around your layout, processes and expansion plans, so your fab can scale with confidence.

Front-End Wafer Manufacturing

Complex wafer flows with stringent cleanliness and reliability requirements

Key Challenges：

High-frequency wafer carrier movement across multiple production areas

Traffic congestion, delivery delays, and complex WIP routing

Strict particle, vibration, and environmental control requirements

AMHS downtime may directly impact overall fab productivity

MFSG Advantages：

Fab-wide automated transport network centered on OHT

Integrated Stocker, Buffer, and Purge solutions

AI-driven dispatching for route optimization, traffic control, and WIP balancing

Low-vibration, cleanroom-compatible handling for wafer protection

High-reliability architecture designed for continuous production

Advanced Packaging

Rapidly evolving processes, diverse carrier formats, fragile materials, and highly flexible production routes

Key Challenges：

Multiple carrier types, including FOUPs, frames, panels, and customized carriers

Thin wafers, reconstructed wafers, and panels are vulnerable to warpage and damage

Diverse process routes and non-standardized equipment interfaces

Frequent capacity expansion and process changes require greater system flexibility

MFSG Advantages：

Compatibility with standard and customized carriers

Gentle, stable, and precise handling for fragile materials

Modular transport and storage architecture for different process flows

Flexible integration with heterogeneous equipment and interfaces

Scalable system design that supports future expansion and process upgrades

Back-End
Assembly & Test

High product variety, fast production cycles, dense processing stations, and strong requirements for throughput, delivery efficiency, and traceability

Key Challenges：

Multiple carrier formats, including trays, magazines, and wafer frames

Frequent loading, unloading, and line-side material delivery

High risk of material mix-ups, misrouting, and orientation errors

Tight coordination required across testing, sorting, and packaging processes

Accurate lot-level and product-level traceability is essential

MFSG Advantages：

Leveraging Front-End AMHS Experience for Back-End Manufacturing

Multi-carrier compatibility and high-frequency line-side delivery

Automated sorting, buffering, and material supply to improve equipment utilization

Carrier, lot, and product data binding for full traceability

Reduced manual handling and lower risk of material errors

Seamless integration with testing, sorting, and packaging equipment

Talk to Our Experts

Smarter Material Flow.
Better Fab Performance.