In non-vacuum environments where wafers are situated, the purification is achieved using the wafer fab's power system (N2/XCDA) with positive pressure and closed-loop control systems. The TLP able to achieve a reduction in FOUP humidity to below RH1% within an extremely short time.
Optional Configurations including Position sensors/temperature and humidity sensors/pressure gauges/flow meters/Mass Flow Controller (MFC)
Benefits
The benefits of a TLP System include :
User friendly interface
Stable system integration
Standalone Control Board
High-Speed Purging
Compatibility with Various EAP Communications
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