An efficient method to block off any particles that could flow inward into the FOUP has been installed in the EFEM, lowering cross-process wafer contamination and oxidation. Low humidity and reduced VOC contamination are ensured by combining MFSG FPS and TLP (tool load port purge). With a strong airflow and an air knife placed in the EFEM, the MFSG FPS can quickly purge while maintaining a low internal humidity and little particle count in the FOUP/Pod. By utilizing the already-existing FOUP, MFSG FPS lowers the upfront expenditure.
The benefits of a FPS include :
In conjunction with the overhead rail system, the solution provides aerial bulk storage positions for FOUP/pod/reticle pod, enhancing space utilization in wafer fabrication plants and maximizing the efficiency of wafer carrier transfers between processes.
Through a well-planned purge pipeline layout and the addition of purification units, the system introduces pure gas into the storage environment, ensuring a controlled microenvironment within the photomask boxes and improving product yield.
Optional Configuration including 1/2/3/4 storage port
The benefits of an OPS include :
In non-vacuum environments where wafers are situated, the purification is achieved using the wafer fab's power system (N2/XCDA) with positive pressure and closed-loop control systems. The TLP able to achieve a reduction in FOUP humidity to below RH1% within an extremely short time.
Optional Configurations including Position sensors/temperature and humidity sensors/pressure gauges/flow meters/Mass Flow Controller (MFC)
The benefits of a TLP System include :
At MFSG, we see ourselves as a key driver in helping our semiconductor fab customers increase operational efficiency and reduce operating costs. Efficiency, flexibility, and reliability are core elements of our team culture.