An efficient method to block off any particles that could flow inward into the FOUP has been installed in the EFEM, lowering cross-process wafer contamination and oxidation. Low humidity and reduced VOC contamination are ensured by combining MFSG FPS and TLP (tool load port purge). With a strong airflow and an air knife placed in the EFEM, the MFSG FPS can quickly purge while maintaining a low internal humidity and little particle count in the FOUP/Pod. By utilizing the already-existing FOUP, MFSG FPS lowers the upfront expenditure.
The benefits of a FPS include :
The OPS system is a purge functionality installed on existing OHB infrastructure which allows for controlled humidity in the FOUP
The benefits of an OPS include :
In order to improve quality control throughout the production process, high-flow XCDA gas is typically introduced in essential equipment during the wafer process. Results indicate that the yield has improved. The microenvironment humidity of the FOUP may be lowered by MF TLP to below RH1 percent in a relatively short period of time.
The benefits of a TLP System include :
At MFSG, we see ourselves as a key driver in helping our semiconductor fab customers increase operational efficiency and reduce operating costs. Efficiency, flexibility, and reliability are core elements of our team culture.