An efficient method to block off any particles that could flow inward into the FOUP has been installed in the EFEM, lowering cross-process wafer contamination and oxidation. Low humidity and reduced VOC contamination are ensured by combining MFSG FPS and TLP (tool load port purge). With a strong airflow and an air knife placed in the EFEM, the MFSG FPS can quickly purge while maintaining a low internal humidity and little particle count in the FOUP/Pod. By utilizing the already-existing FOUP, MFSG FPS lowers the upfront expenditure.